News

The Soitec Group (Euronext Paris), the world’s leading supplier of engineered substrates for the microelectronics industry, announced today that the company is ready with the Ultra-Thin Buried Oxide (UTBOX) extension to its Ultra-Thin (UT) silicon-on-insulator (SOI) platform, thereby providing a robust substrate solution for chip designers tackling the performance, power and density challenges of mobile consumer devices. Fully Depleted (FD) planar body transistors are now recognized as the right path on the CMOS roadmap for the 22nm generation and beyond. With FD planar transistor technology on UTBOX wafers, chip designers can enhance their usual design flows and techniques. High-volume capacity is available for the 22nm node at Soitec's manufacturing sites in France and Singapore. See more.