EUROSOI Announcements

The 2010 IEEE International SOI Conference Committee has extended the deadline for submission of papers to be considered for presentation at the conference to be held in San Diego, California this October until June 4th.

This year's SOI conference will be highlighted by exciting plenary and invited talks. NASA JPL will discuss challenges in electronic design for interplanetary explorations. IBM will cover topics on SOI ASIC design, and FDSOI technologies; IMEC and Intel will discuss silicon photonics, ST Microelectronics will discuss RF applications while Tohoku University will discuss 3D integration. The SOI conference is the ideal forum to exchange and network. The SOI conference is an enriching forum where not only digital and power IC electronics is discussed but also expands discussion to wafer engineering and circuit transfer techniques opening up a spectrum of new applications like 3D, photonics, nano-technologies and devices architectures beyond CMOS.